![]() ![]() This chapter presents the step-by-step application of the Six Sigma define, measure, analyze, improve, control (DMAIC) approach to eliminate defects in a lithography process of a semiconductor manufacturing organization. Six Sigma methodology is often neglected in most fabs, and this chapter gives an overview of its importance and how it can be implemented to reduce defects with the help of a general case study. Defects become a big challenge in the efforts to reduce feature size in most semiconductor fabs as they negatively impact product yields. In order to manufacture nanometer range scale chips, there is a tremendous impetus toward developing advanced process control and measurement system capabilities. With rapid advancements in computers, artificial intelligence, and automotive vehicles, biomedical imaging semiconductor manufacturers find themselves constantly battling the demanding needs of the industry to sustain Moore’s law and manufacture smaller chips to support next-generation software and hardware products. Six Sigma practitioners often lead cross-functional teams in an organization to find and eliminate the causes of the errors, defects, lead, and cycle time delays in business processes. Six Sigma framework is a continuous improvement strategy that minimizes defects and process variation toward an achievement of 3.4 defects per million opportunities in design, manufacturing, and service-oriented industries. ![]()
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